1. Ultra-fine marking, with extremely small focused light spots and small thermal effects, capable of ultra-fine marking, which is a choice with higher demand for marking.
2. The marking effect has high engraving accuracy, and the small line width can reach 0.015mm, which can meet the needs of engraving a large amount of data on very small workpieces.
3. Suitable for marking of special materials. UV laser marking is cold processing, and the beam is delicate. It does not cause heating or thermal deformation on the inner layer and nearby areas of the processed surface.
4. The marking range is wide, it can mark all metals and some non-metals, and it can meet the marking requirements of 95% of users' products.
5. Fast editing and development, the combination of laser technology and computer technology, as long as programming on the computer can realize laser printout, and the marking content can be changed at any time.
National Service Hotline 0769-8122-1176
2019.06.17
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The Structural Characteristics of 10W UV Laser Marking machine
10W UV laser marking machine belongs to the series of laser marking machines, but it is developed by using 355nm UV laser. This machine uses third-order intra-cavity frequency doubling technology. Compared with infrared laser, 355 UV light focusing spot is very small. To a large extent reduce the mechanical deformation of the material and the small thermal impact of processing, because it is mainly used for ultra-fine marking and engraving, especially suitable for food, pharmaceutical packaging material marking, micro-holes, high-speed division of glass materials and Silicon wafers perform complex pattern cutting applications.
Application industry of 10W UV Laser Marking machine
The UV laser marking machine is mainly based on its low-power laser beam, which is especially suitable for ultra-fine processing in the high-end market. Cosmetics, pharmaceuticals, video and other polymer materials are marked on the surface of packaging bottles. Better than ink coding and no pollution; marking and dicing of flexible pcb boards; micro-hole and blind hole processing of silicon wafers; two-dimensional code marking of LCD liquid crystal glass, hole punching on glass appliances, metal surface plating marking Plastic buttons, electronic components, gifts, communication equipment, construction materials, etc.
